PART |
Description |
Maker |
M6MGT647M17AKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
K522H1HACF-B050 |
MCP Specification
|
Samsung semiconductor
|
S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc. SPANSION LLC
|
K5D5657DCM-F015 K5D5657DCM-F0CL |
MCP Specification of 256Mb NAND and 256Mb Mobile SDRAM MCP / 256Mb NAND and 256Mb Mobile SDRAM
|
SAMSUNG[Samsung semiconductor] Samsung Electronics
|
DS42546 AM29DL163D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM From old datasheet system MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
DS42587 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装(MCP)闪存和SRAM
|
Advanced Micro Devices, Inc.
|
S71PL129JB0BAW9U3 S71PL129JB0BAI9U0 S71PL129JB0BAI |
JT 18C 18#20 PIN WALL RECP 堆叠式多芯片产品(MCP)的快闪记忆 JT 15C 14#20 1#16 PIN WALL REC SPECIALTY MEMORY CIRCUIT, PBGA64 JT 15C 14#20 1#16 SKT PLUG 堆叠式多芯片产品(MCP)的快闪记忆 JT 37C 37#22D SKT PLUG Circular Connector; No. of Contacts:37; Series:MS27473; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:14-35 RoHS Compliant: No Stacked Multi-Chip Product (MCP) Flash Memory
|
Spansion, Inc. Spansion Inc.
|
F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Corporation
|
WF4M32-XH2X5 WF4M32-XG2TX5 WF4M32-XG4TX5 |
Flash MCP 闪存MCP
|
OKI SEMICONDUCTOR CO., LTD.
|
WF512K32N-XH1X5 WF512K32-XG1UX5 |
Flash MCP 闪存MCP
|
OKI SEMICONDUCTOR CO., LTD.
|